Before the chip leaves the factory, it needs to be sent to a professional packaging and testing factory （Final Test）. A large package & test factory has hundreds or thousands of test machines, chips in the test machine to undergo high and low temperature inspection, only passed the test chip can be sent to the customer.

The chip needs to test the operating state at a high temperature of more than 100 degrees Celsius, and the test machine quickly reduces the temperature to below zero for many reciprocating tests. Because compressors are not capable of such rapid cooling, liquid nitrogen is needed, along with Vacuum Insulated Piping and Phase Separator to deliver it.

This test is crucial for semiconductor chips. What role does the application of the semiconductor chip high and low temperature wet heat chamber play in the test process?

1. Reliability assessment: high and low temperature wet and thermal tests can simulate the use of semiconductor chips under extreme environmental conditions, such as extremely high temperature, low temperature, high humidity or wet and thermal environments. By conducting tests under these conditions, it is possible to assess the reliability of the chip during long-term use and determine its operating limits in different environments.

2. Performance analysis: Changes in temperature and humidity may affect the electrical characteristics and performance of semiconductor chips. High and low temperature wet and thermal tests can be used to evaluate the performance of the chip under different temperature and humidity conditions, including power consumption, response time, current leakage, etc. This helps to understand the performance changes of the chip in different working environments, and provides a reference for product design and optimization.

3. Durability analysis: The expansion and contraction process of semiconductor chips under the conditions of temperature cycle and wet heat cycle may lead to material fatigue, contact problems, and de-soldering problems. High and low temperature wet and thermal tests can simulate these stresses and changes and help evaluate the durability and stability of the chip. By detecting chip performance degradation under cyclic conditions, potential problems can be identified in advance and design and manufacturing processes can be improved.

4. Quality control: high and low temperature wet and thermal test is widely used in the quality control process of semiconductor chips. Through the strict temperature and humidity cycle test of the chip, the chip that does not meet the requirements can be screened to ensure the consistency and reliability of the product. This helps to reduce the defect rate and maintenance rate of the product, and improve the quality and reliability of the product.

HL Cryogenic Equipment 

HL Cryogenic Equipment which was founded in 1992 is a brand affiliated to HL Cryogenic Equipment Company Cryogenic Equipment Co.,Ltd. HL Cryogenic Equipment is committed to the design and manufacture of the High Vacuum Insulated Cryogenic Piping System and related Support Equipment to meet the various needs of customers. The Vacuum Insulated Pipe and Flexible Hose are constructed in a high vacuum and multi-layer multi-screen special insulated materials, and passes through a series of extremely strict technical treatments and high vacuum treatment, which is used for transferring of liquid oxygen, liquid nitrogen, liquid argon, liquid hydrogen, liquid helium, liquefied ethylene gas LEG and liquefied nature gas LNG.

The product series of Vacuum Valve, Vacuum Pipe, Vacuum Hose and Phase Separator in HL Cryogenic Equipment Company, which passed through a series of extremely strict technical treatments, are used for transporting of liquid oxygen, liquid nitrogen, liquid argon, liquid hydrogen, liquid helium, LEG and LNG, and these products are serviced for cryogenic equipment (e.g. cryogenic tanks and dewar flasks etc.) in industries of electronics, superconductor, chips, MBE, pharmacy, biobank / cellbank, food & beverage, automation assembly, and scientific research etc.